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ED Copper Foil Specification
Why choose copper foil material for RF/MRI Room Installation?
Submicron ultra fine treatment with influencing hardly no affects on profile securing large bond area realized
RzJIS 2.5 microns Additional treatment on raw foil shiny side enables lower profile.
Mat side treatment has high heat resistance and would not have any defects such as blisters of CCL on flow
soldering or reflow soldering
Quality Items | General Technical Terms | |||||
2oz | 3oz | 4oz | 5oz | 6oz | ||
(70um) | (105um) | (0.14mm) | (175um) | (210um) | ||
Area Weight g/m2 | 585±25 | 915±45 | 1220±60 | 1525±75 | 1830±90 | |
Leakage Points | No | |||||
points/m2 | ||||||
Quality of electrical | ≤0.162 | |||||
resistivity | ||||||
Ω·g /m2 | ||||||
Anti-Oxidization | No Oxidization | |||||
Performance | ||||||
160 centigrade/30min | ||||||
Width Tolerance | 1290.0±1.0 | 1320.0±1.0 | 1370.0±1.0 | |||
mm |
Characteristic:
1. High performance, vertically-supported modular enclosure
2. Reinforced wall design
3. Lightweight
4. Installed in more MRI sites worldwide than any other shield system
5. Easily and quickly modified on site should a problem or change occur
6. Copper serves as an eddy current shield for EMI protection
Producing Process
Product packaging
Size | 1500mm*330mm*463mm |
Weight | 263kg |
Packaging Details | The normal package is wooden box(Size: L*W*H). If export to european countries,the wooden box will be fumigated.If container is too tigher,we will use pe film for packing or pack it according to customers special request. |