Jovvi international
Beijing Hengtai Tech Co., Ltd
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Mri Room Copper Foil Panels For EMI Shielding Application
Description:
It has good electrical conductivity, thermal conductivity, corrosion resistance, and processing properties,
and can be welded and brazed. It contains fewer impurities that reduce electrical conductivity and thermal
conductivity and a small amount of oxygen has little effect on electrical conductivity, thermal conductivity,
and processing properties, but it is easy to cause "hydrogen disease", and it is not suitable for processing
(annealing, annealing, welding, etc.) and use.
Specification:
ED copper foil
| Qualtiy Items | General Technical Terms | ||||
| Normal thickness | 2oz | 3oz | 4oz | 5oz | |
| 0.07mm | 0.105mm | 0.14mm | 0.175mm | ||
| Area Weight(g/m2) | 560-610 | 838-960 | 1100-1280 | 1380-1600 | |
| Tensile strength | Room temperature | ≥28 | ≥28 | ≥28 | ≥28 |
| (kg/mm2) | |||||
| Elongation | Room temperature | ≥10 | ≥10 | ≥10 | ≥10 |
| % | |||||
| Leakage points(points/m2) | No | ||||
| High temperature Anti-Oxidization Performance(180℃/h) | No Oxidization | ||||
| Width Tolerance | (+2.0 ,-2.0) | ||||
